High flexibility and high protection for electronic parts
- high-transparent (crystal clear), translucent-opaque or white colors
- easy to color with liquid pigment pastes
- optimal flowability and low viscosity
- highly thixotropic
- easy pouring operation
- ideal curing time and operation times (pot life) at room temperature
- curing time and pot life can be adjusted by using different catalysts
- suitable for use in manual and automatized processing systems
- very good bonding feature, good adhesion to plastic housings
- high flame and temperature resistance (up to 300°C)
- high thermal conductivity
- flexible at particularly low temperatures (down to -100°C)
- good temperature-cycling resistance
- easy degassing
- low level of outgassing
- low shrinkage
- low bleeding levels of uncrosslinked components
- pronounced damping
- specified, low ion content
- comply with FDA and RoHS requirements
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For further information about our solutions for Electronic Potting & Encapsulation, LED Filling, please contact us. Our experts will assist you in making the right choices to secure the product properties you seek.